| Mfg Part Number: 27C128-25BXA | Alternate P/N: 27C12825BXA |
| NSN : 5962-01-300-0495 | NIIN : 013000495 |
| CAGE Code : 60991 | Manufacturer: Microchip Components |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
We appreciate your interest in our available 27C128-25BXA NSN components. We are a leading distributor of NSN parts like 5962-01-300-0495, sourcing from top manufacturers like Microchip Components. If you would like an immediate quote for comparison on item Microcircuit Memory part 27C128-25BXA, please complete the RFQ provided on this page, and an account manager will reach out to you in 15 minutes or less. We aim to formulate our quotes with your unique needs in mind, so we ask you to please complete the RFQ with as much information as you can provide.
A National Stock Number (NSN) is a 13 digit numeric code assigned to items that allows for categorization and tracking through the federal supply system. These numbers are unique to each item and allow for accountability and ease of tracking. Aerospace Domain is a top distributor of NSN parts like 27C128-25BXA from trusted manufacturers like Microchip Components. For this individual part, we have also included its CAGE Code 60991 and FSC 5962 Microcircuits Electronic for convenience. Many of our NSN parts are subjected to rigorous quality assurance testing, which is why we stand by the quality of our products. We look forward to helping you acquire your NSN parts. For purchasing on the go, download the ASAP Semiconductor from the Google Play and Apple Store today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-300-0495 Item Description: Microcircuit Memory | 5962 | 013000495 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 27c128-25bxa | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM POWER SOURCE AND 6.25 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.165 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE AND ULTRAVIOLET ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQZP | INPUT CIRCUIT PATTERN | 17 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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