| Mfg Part Number: C1103 | NSN : 5962-00-530-4664 |
| NIIN : 005304664 | CAGE Code : 34649 |
| Manufacturer: Intel | Item Name : Microcircuit Memory |
| FSC : 5962 Microcircuits Electronic |
We appreciate your interest in our available C1103 NSN components. We are a leading distributor of NSN parts like 5962-00-530-4664, sourcing from top manufacturers like Intel. If you would like an immediate quote for comparison on item Microcircuit Memory part C1103, please complete the RFQ provided on this page, and an account manager will reach out to you in 15 minutes or less. We aim to formulate our quotes with your unique needs in mind, so we ask you to please complete the RFQ with as much information as you can provide.
A National Stock Number (NSN) is a 13 digit numeric code assigned to items that allows for categorization and tracking through the federal supply system. These numbers are unique to each item and allow for accountability and ease of tracking. Aerospace Domain is a top distributor of NSN parts like C1103 from trusted manufacturers like Intel. For this individual part, we have also included its CAGE Code 34649 and FSC 5962 Microcircuits Electronic for convenience. Many of our NSN parts are subjected to rigorous quality assurance testing, which is why we stand by the quality of our products. We look forward to helping you acquire your NSN parts. For purchasing on the go, download the ASAP Semiconductor from the Google Play and Apple Store today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-530-4664 Item Description: Microcircuit Memory | 5962 | 005304664 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| C1103 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAU | BODY HEIGHT | 0.025 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -25.0/+85.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
| ADAQ | BODY LENGTH | 0.890 INCHES MINIMUM AND 0.960 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.275 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 400.0 MILLIWATTS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 94117-310180 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
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