| Mfg Part Number: 52SPL-93425 | Alternate P/N: 52SPL93425 |
| NSN : 5962-01-049-1498 | NIIN : 010491498 |
| CAGE Code : 57230 | Manufacturer: Gould Inc Simulation Systems Div |
| Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
We appreciate your interest in our available 52SPL-93425 NSN components. We are a leading distributor of NSN parts like 5962-01-049-1498, sourcing from top manufacturers like Gould Inc Simulation Systems Div. If you would like an immediate quote for comparison on item Microcircuit Memory part 52SPL-93425, please complete the RFQ provided on this page, and an account manager will reach out to you in 15 minutes or less. We aim to formulate our quotes with your unique needs in mind, so we ask you to please complete the RFQ with as much information as you can provide.
A National Stock Number (NSN) is a 13 digit numeric code assigned to items that allows for categorization and tracking through the federal supply system. These numbers are unique to each item and allow for accountability and ease of tracking. Aerospace Domain is a top distributor of NSN parts like 52SPL-93425 from trusted manufacturers like Gould Inc Simulation Systems Div. For this individual part, we have also included its CAGE Code 57230 and FSC 5962 Microcircuits Electronic for convenience. Many of our NSN parts are subjected to rigorous quality assurance testing, which is why we stand by the quality of our products. We look forward to helping you acquire your NSN parts. For purchasing on the go, download the ASAP Semiconductor from the Google Play and Apple Store today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-049-1498 Item Description: Microcircuit Memory | 5962 | 010491498 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | U | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 52spl-93425 | 3 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.285 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 835.0 MILLIWATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND W/DISABLE AND W/ENABLE AND 3-STATE OUTPUT |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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