| Mfg Part Number: 31L01DM | NSN : 5962-00-584-0669 |
| NIIN : 005840669 | CAGE Code : 34335 |
| Manufacturer: Advanced Micro Devices Inc | Item Name : Microcircuit Memory |
| FSC : 5962 Microcircuits Electronic |
We appreciate your interest in our available 31L01DM NSN components. We are a leading distributor of NSN parts like 5962-00-584-0669, sourcing from top manufacturers like Advanced Micro Devices Inc. If you would like an immediate quote for comparison on item Microcircuit Memory part 31L01DM, please complete the RFQ provided on this page, and an account manager will reach out to you in 15 minutes or less. We aim to formulate our quotes with your unique needs in mind, so we ask you to please complete the RFQ with as much information as you can provide.
A National Stock Number (NSN) is a 13 digit numeric code assigned to items that allows for categorization and tracking through the federal supply system. These numbers are unique to each item and allow for accountability and ease of tracking. Aerospace Domain is a top distributor of NSN parts like 31L01DM from trusted manufacturers like Advanced Micro Devices Inc. For this individual part, we have also included its CAGE Code 34335 and FSC 5962 Microcircuits Electronic for convenience. Many of our NSN parts are subjected to rigorous quality assurance testing, which is why we stand by the quality of our products. We look forward to helping you acquire your NSN parts. For purchasing on the go, download the ASAP Semiconductor from the Google Play and Apple Store today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-584-0669 Item Description: Microcircuit Memory | 5962 | 005840669 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | U | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 31l01dm | 3 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | ROM |
| ADAT | BODY WIDTH | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND W/DECODED OUTPUT AND LOW POWER AND SCHOTTKY AND W/BUFFERED OUTPUT AND EXPANDABLE AND W/OPEN COLLECTOR AND W/STORAGE AND WIRE-OR OUTPUTS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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